Samsung Electronic said in a statement the chip will be made using high-tech chip architecture known as gate all-around (GAA) and multiple chips will be integrated in one package to enhance inter-connection speed and reduce size. Read The Rest at :
Disclaimer : Mymoneytimes implements extreme caution and care in collecting data before publication. Mymoneytimes does not liable for the adequacy, accuracy or completeness of any given information. Hence we are not liable for any kind of direct or indirect loss caused by the use of such information.
