Sahasra to raise funds to meet semiconductor packaging plant's capex

Sahasra Electronic, an Indian electronics and PCB manufacturer, plans to raise Rs 186 crore through an IPO for capital expenditure and working capital needs. The funds will be used to scale up its semiconductor packaging unit in Rajasthan. The IPO opens on September 26, 2024, with a price band of Rs 269-283 per share.
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