In the second phase of the India Semiconductor Mission, the government plans to focus on attracting compound semiconductor fabrication and silicon photonics companies, with minimal financial incentives for chip packaging units. Existing incentives include 50% of project costs from the central government and additional benefits from state governments. Four approved semiconductor units are at various stages of construction, with a total proposed investment of ₹1.48 lakh crore under the ₹76,000 crore mission.